Study of high power COB LED modules with respect to topology of chips

The thermal influence of the topology of the COB (Chip-on-Board) LED modules is examined. For this purpose CFD simulations of a powerful COB LED module thermal model are carried out and the thermal distribution at different locations of LED chips is analyzed. Simulation experiments are designed, using the substrates of ceramic materials - Alumina (Typical), Alumina (94 %), Alumina (96 %) and AlN. The thermal efficiency of four different structures of COB LED modules with different modes of operation and environment is examined. The simulation results are verified with thermal measurements.