The realiazation of big networking dream from challenging electronic to interconnect technology (part 1)

This article is part 1 of a series of study on new generation of electronic challenging and interconnects process technology for networking computer products such as core router for service provider, edge and branch router for enterprise networking companies, and small switch and wireless router for commercial and SOHO (small and home office). All these networking products require high data speed in tera bits per second and high reliability for new generation of mobile user whenever and wherever they are. The super mobility and reliability performances are backbone for this big dream of networking. To achieve such a mobility and reliability, a test vehicle (TV) as an emulator for future networking product is designed to include pad shape, pad orientation, via to pad spacing, surface finish for miniature 0201 component. Board flatness correlation warpage of 4 different sockets is also study to see the influence to component placement. A high I/O 1.0mm pitch of square PBGA with various VIP design and via filled vs. capped process was used on the TV to see solder quality and networkability. Other rework processes development for single/double socket and QFN, SMT connector, CANPAK VRD are also studied. Various tail length of DIMM and E-cap combined with solder thieve design are incorporated to see the effect of important hole fill and bridge defect. The purpose of the program is to use design and process technology with above challenging characteristic in circuit design to gain the most optimized interconnection to achieve the speed of data transfer and signal integrity for new generation of networking product. In part 2 of the study, the assembly process is developed for a fiber optical module and particulate control and management on the top of achievement from part 1 to further enhance networking performance.