Study on the impact of height of solder joints with compliant layer on stress and strain under thermal cycle

The 3D finite element analysis model of chip scale package solder joints with compliant layer was established, the thermal-structure finite element analysis of the model was performed, the stress and strain distribution of the solder joints with complaint layer was obtained under the condition of thermal-structure, the influences of the height of solder joints with complaint layer structure were studied. Results shows that the compliant layer structure can reduce the stress and strain of solder joints effectively. With the increase height of solder joints with complaint layer, the maximum stress and strain of the solder joints decrease.