Study on impacts of configuration parameters on flip stacked Au bumps stress and strain under random vibration load

The 3D finite element analysis model of flip stacked AU bumps was developed, its stress and strain distribution under random vibration load were analyzed by ANSYS the finite element analysis software. Solder joint height, solder maximum radial size, solider distribution were selected as four key configuration parameters, their impacts on the models' stress and strain distribution were also studied, the results showed that: under random vibration load, the bumps array maximum stress and strain appeared on the farthest position away from the center of the array of bumps, with the increase of the bump height/diameter in distribution, the maximum stress and strain decrease gradually.