86.55% Peak efficiency envelope modulator for 1.5W 10MHz LTE PA without AC coupling capacitor

For achieving boost capability and wideband with high efficiency in Envelope Modulator (EM), a newly proposed topology is introduced in this paper. The proposed EM consists of two converters: one is Low Frequency Converter (LFC) with Single Inductor Dual Output (SIDO) and the other is High Frequency Converter (HFC) with wideband capability. The two converters are combined directly in parallel without AC coupling capacitor by employing Low Frequency Current Balancing (LFCB) technique. The chip is implemented in 0.18μm CMOS process achieving 86.55% peak efficiency while tracking a 10MHz LTE envelope signal.