Title: In-depth analysis to identify process related defects causing Electrical Overstress on Clip bonded Schottky power rectifiers: A case study

Identifying process related defects that can trigger Electrical Overstress (EOS) is very important in order to address the real root cause of failure. This paper presents case study where in-depth analysis performed on Clip-bonded Schottky rectifiers found with EOS damage identified potential assembly and wafer fabrication defects, leading to effective corrective actions.