Junction/well stain (delineation) technique to unveil different types of implantation defects

Implantation is a key process in semiconductor manufacturing. However, the implantation related defects are not easily inspected by Scanning Electron Microscope, Transmission Electron Microscopy and Focused Ion Beam without chemical treatment. In this paper, implantation related defects were isolated by FA techniques and wet chemical stain technique was employed to unveil the different types of implant defects.