Application of FIB-SEM and Raman spectroscopy for investigating conductive carbon particles in epoxy encapsulation of IC

We report investigation about three types of conductive carbon particles viz. pure carbon particles, SiO
2
filler mixed carbon particles, and SiO
2
@C core-shell particles in epoxy encapsulations of IC. SEM, EDX, FIB voltage contrast imaging, and Raman spectroscopy are used to characterize conductive carbon particles, and to identify their potential origin.