Integration of micro heat sink in silicon technology

The use of microchannels in silicon substrates as a forced liquid cooling device for power integrated circuits is investigated. The new concept presented in this work consists of placing water cooled heat sink structure directly inside the silicon substrate in order to be as close as possible to the heat generation source (circuit) and to reduce the number of heterojunctions involved in the cooling device, so to reduce the thermal stress. Thanks to commercially available software, Flux3D and Pascosma, some simplifying hypotheses were proposed and thermal dissipation characteristics are optimised for several microchannel geometries as a function of some constraints. Finally, fin technological realisation procedure is described.