WLCSP+ and eWLCSP in FlexLine: Innovative Wafer Level Package manufacturing

The demand for Wafer Level Chip Scale Packages (WLCSP) has experienced tremendous growth due to the surge in demand for advanced mobile products. The increased demand is seen for both 200mm wafers and 300mm wafers, however a significant segment of the market continues to be driven by 200mm designs. The infrastructure capacity supporting 200mm WLCSP has been stressed as a result of the mature status of 200mm technology and the rate of conversion of alternative package formats to WLCSP. This creates a dilemma for WLP service providers because adding 200mm capacity continues to require a significant amount of capital. Since 200mm volumes will most likely decline within the next 5 years, it is difficult to justify the purchase of capital when the depreciation term is longer than the anticipated life cycle of the product.