Active and passive integration on flexible glass substrates: Subtractive single micron metal interposers and high performance IGZO thin film transistors

Flexible glass is one of the most promising innovations in the 21st century. Its applications in roll-to-roll (R2R) based manufacturing can yield low cost, conformable, and transparent electronics. In this work, we introduce electronic interposer substrates consisting of multiple metal-insulator layers of subtractively processed single micron metal circuit lines as well as high performance IGZO thin film transistors fabricated on Corning® Willow® Glass. All processes are compatible with R2R patterning and fabrication.