Fabrication and characterization of mixed-signal polymer-enhanced silicon interposer featuring photodefined coax TSVs and high-Q inductors

This paper demonstrates: (a) low-loss photodefined polymer-embedded copper vias within a 10 Ω-cm resistivity silicon to yield electrical performance similar to glass interposers; (b) coaxial polymer-embedded vias with desired wideband impedance and reduced coupling; and (c) high-Q inductors attained using the photodefined polymer-enhancement technology.