High-volume-manufacturing (HVM) of BVA™ enabled advanced package-on-package (PoP)

Bond-Via-Array (BVA™) technology has been developed to address the high density interconnect requirements of the next generation of package-on-package (PoP) solutions. This technology, while utilizing conventional assembly processes and equipment, can provide more than 1000 interconnections between the memory and the logic packages when stacked in a PoP format within a standard PoP package footprint. The vertical interconnections are achieved by utilizing well established wire-bond equipment and processes. An array of free-standing wire-bonds is formed along the periphery of the logic package to form electrical connections to the topside memory package. In this paper, key assembly process steps including free standing vertical wire-bond formation, film assist molding and fine-pitch PoP stacking will be described along with the results from manufacturing and reliability studies conducted in cooperation with 3
^rd
party equipment vendors to validate HVM readiness.