The new generation package free LED: The performance and reliability of white chip

Package free LED, whose characteristics as no leadframe/ reflector, is one of those emerging technology [1]. The package free LED has arose excessive attention in recent years because of its benefits in excellent color consistence, wide light distribution, low material cost and simple process. This study assesses the performance of “sheet forming type” package free LED under operational and humidity conditions. The lumen maintenance study shows insignificant degradation of opto-electrical performance of the devices. Color shift is also minimal. In the accelerated humidity condition, the device failed mostly due to die failure. Minimal optical degradation was found in the phosphor layer. Moisture induced failure which affects the interfacial integrity should be addressed so as to improve the reliability of the package free LED.