A conceptual assembly study on enhancing the voltage capability of the FlatPower package platform via Tandem diodes

In this publication we demonstrate the manufacture of so-called Tandem diodes in a soft-soldered, stacked-die configuration. Compared to the planar product design, where the dies are placed next to each other and wire bonded, the needed board space can be reduced significantly, lowering cost and application size. We discuss the manufacturability and the critical processing items and show their feasibility.