Mechanical reliability assessment of 28nm Back End of Line (BEoL) stack using finite element analysis and validation

In order to address the Chip-Package Interaction (CPI) challenges at an early stage of the product development, GLOBALFOUNDRIES has developed Finite Element (FE) models to simulate the mechanical stress in Backend of Line (BEoL). This paper elaborates the methodology involved in developing a single bump simulation model to assess failure risk under mechanical loading. The paper also highlights the FE models validation by comparing the simulation results to the experimental test data.