Physics of failure based reliability modeling framework for electronics

Traditional reliability model, which is based on fault state logic of product composition units, has inherent limitations, e.g., it can't map the failure caused by cumulative error of performance degradation or parameter drift, and can't associate reliability requirements or product failure time with product design parameters so that little use is got to support testability or PHM function design, etc. In order to overcome these shortcomings, this paper proposesa physics of failure based reliability modeling framework, which is aimed at describing the nature of failure dynamics, of which failure was that the output performance variation driven by mechanisms to go beyond design specifications. This modeling framework includes simulation analysis of the expected dominant failure mechanisms (including device degradation or parameter drift, etc.) by way of classical stress-damage modeling, and study of failure mechanism impact on the product's output with fault injection when the corresponding mechanism taken place. Complete description of the failure dynamics closely links product failure events, design parameters and external conditions together, and it facilitates the reliability and PHM design effort. In this paper, a formal model and its simulation analysis approach were presented, and a case study of an electronic module was also given. This modeling approach is more applicable for digital product design scenario as generally complex simulation calculation is needed in this way.