DBC switch module for management of temperature and noise in 220-W/in3 power assembly

A switch module integrates semiconductor dies on a direct-bond-copper (DBC) substrate to achieve both noise robustness and low thermal resistance. It outperforms the module integrated on printed circuit board (PCB) to meet high-power-density and high-output-power specifications. The DBC substrate attached to an air-cooled heat sink provides 2.35-°C/W thermal resistance to limit the temperature rise of semiconductors switches to 50°C. Compact layout with 2.89-nH common-source inductance and negative coupling between drain and source conductors eliminate self-turn-on from 420-A/µs di/dt. A 2-kW dc-dc boost converter which switched between 400 kHz to 1 MHz achieved a power density of 220 W/in
³
and an efficiency of 98.4% by employing the switch module.