Application of the transient dual interface method in test based modeling of heat-sinks aimed at socketable LED modules

This paper presents a method of thermal characterization of heat-sinks aimed at cooling socketable LED modules. The suggested measurement procedure resembles the transient dual interface method of the JEDEC JESD51-14 standard: two transient measurements are performed with different qualities of the thermal interface of the heat-sink surface mating the LED modules. The structure functions section identified with such a measurement represents solely the measured heat-sink. Step wise approximation of the obtained structure function section is used to create DCTMs of the heat-sinks, aimed at fast system level simulations of LED modules.