Modeling and characterization of wire bonding and tape automatic bonding. Analytical formulas and experimental validation

A simplified method has been established to model and characterize two types of short interconnections: wire bonding and tape automatic bonding (TAB). A comparison between these two parasitic elements is presented and analytical formulas easy to use in CAD applications are proposed to calculate their inductance. These results are compared with measurements performed in the frequency range of (1-30) GHz.