MEMS packaging by using dry film resist

Wafer-level and chip-level bonding of micro-caps to protect sensitive parts are crucial process steps for MEMS integration and packaging. The use of a photosensitive polymer as a bonding and sealing layer is a cheap and simple solution. Hot roll lamination of dry film guarantees very uniform coating of thick polymer layers over wafers with complex topology and moreover has the capability to bridge over etched cavities. The paper presents the results obtained bonding both quartz and glass caps over MEMS devices, either wafer to wafer or single cap to chip, using two different kinds of permanent dry film.