A dual-axis MEMS inertial sensor using multi-layered high-density metal for an arrayed CMOS-MEMS accelerometer

This paper reports a novel dual-axis MEMS inertial sensor that utilizes multi-layered electroplated gold. All the MEMS structures are made by gold electroplating that is used as post-CMOS process. Due to the high density of gold, the Brownian noise on the proof mass becomes lower than those made of other materials in the same size. The miniaturized MEMS accelerometer can be integrated in an arrayed CMOS-MEMS accelerometer to detect a broad range of acceleration on a single sensor chip.