Integration study of benzocyclobutene with CVD-based aluminum metallization

Aluminum/liner binary stacks have been deposited on blanket and patterned films of benzocyclobutene (BCB) polymer to investigate its integration into an all-aluminum multilevel wiring structure. Blanket stacks were characterized for structural properties and reliability. Metallized patterned films were analyzed for gap filling of 0.30 /spl mu/m trenches. Aluminum was deposited via chemical vapor deposition (CVD). Titanium nitride liners were deposited via collimated reactive sputtering.