Cutting PCB with a 532nm DPSS green laser

The use of lasers in the field of microelectronics is growing and diversifying as designers look to innovative technologies to enable the ever-increasing sophistication of their products. Lasers are employed in manufacturing processes as varied as semiconductor lithography, wafer dicing, micro-welding and via drilling. The primary driver for the use of laser technology is the relentless progression towards miniaturization — lasers offering a highly accurate, precise and non-contact alternative to conventional manufacturing processes — ideal for processing the delicate micro-scale components employed in modern electronic devices [1].