Mechanical property analyses on power diodes in a typical 5W adapter

In this paper, we perform thermal and thermo-stress analyses on diode packaging with both currently used (traditional) and the newly designed (Zowie) structures in a 5W power adapter. To this end, a global-local methodology with ANSYS FEM software were employed with the equivalent material property equations, and temperature distribution measurements were simultaneously carried out for verification and extracting boundary conditions. The simulated mechanical behaviors on the two packaging designs are finally compared with discussions in this study.