Drain extended MOS device design for integrated RF PA in 28nm CMOS with optimized FoM and ESD robustness

This paper explores drain extended MOS (DeMOS) device design guidelines for an area scaled, ESD robust integrated radio frequency power amplifier (RF PA) for advanced system-on-chip applications in 28nm node CMOS. Simultaneous improvement of device-circuit performance and ESD robustness is discussed for the first time. By device design optimization a 45% increase in gain and 25% in power-added efficiency of RF PA at 1GHz, and 5× improvements in ESD robustness are reported experimentally.