Highly accurate and quick bonding for planar lightwave circuit and laser-diode chip

A new method for accurately and quickly bonding a planar light waveguide circuit (PLC) and a laser diode is proposed. The method is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the proposed method was accurate within /spl plusmn/1 /spl mu/m. The turnaround time, from picking up the laser diode with vacuum tweezers to completion of the bonding process, was 2 1/4 minutes.