Study of sparkover issue in packaging

A premature failure has been investigated and proved to be caused by the sparkover between no-connect metal cover and chip of ceramic packaging. Sparkover-induced model with the parasitic parameters of human body and ESD(electrostatic discharge) tester was created to explain the failure mechanism. Simulation and experiment were performed to verify the models' accuracy. Furthermore, the first peak and second peak of the discharge current were studied by experimenting on printed circuit board designed on the basis of sparkover-induced model. The results show the discharge current is influenced by a series of parameters, such as spacing, area, parasitic capacitance and so on.