The application of transient thermal analysis in solder joint thermal fatigue life analysis

In this paper, a method of solder joint thermal fatigue life analysis using transient thermal analysis is introduced, and also a case study of temperature shock test to an CPU module. The results show that this method obtained the temperature load under actual use, which is closer to engineering problems. The module's maximum temperature variation range is 50D-132D. Under the temperature load, the maximum stress of solder joint is 42.8MPa and its thermal fatigue life is 6376 cycles.