Liquid Flux Assisted Bump Bonding Process And Thermal Design For Laser Arrays For Optical Interconnection

Recently, there have been intense industrial efforts in parallel optical interconnection technology2 to overcome the well known copper barrier problems in high speed (- 1 Gb/sec) data communication and processing networks of multi-processor systems. A 18x1 edge-emitting uncooled InP laser array3 (Figure 1) and a 32x1 surface emitting laser array4 are bump bonded to silicon optical bench piece with the help of liquid flux solder reflow process. Effects of liquid flux on some device characteristics are presented in Table 1 a and b.