Fabrication Issues For Free-space Optics At The Board Packaging Level

The successful application of optical interconnects to electronic processing systems requires careful consideration of 1) the electronic system in which it will be used, 2) the availability of competitive advanced electrical interconnect methods, 3) the optical system design and fabrication methods, 4) the electro-optic devices and fabrication process, 5) the interface between electro-optic devices and electronic processing elements, 6) the cost of packaging micro-optical components and electro-optic devices with electronic processing elements, and 7) the reliability of optical interconnects relative to comparable performance electrical interconnects. If one or more of these factors are neglected it could result in a design of limited performance, or performance which can easily be superseded by electrical interconnects.