Results of OEMCM packaging efforts LLNL

An important problem in realizing mass-produced and cost-effective optoelectronic multi-chip modules (OEMCM) is that of coupling the various photonic devices to the optical fiber. There are two critical issues associated with OEMCM packaging which must be addressed. 1) Single-mode fibers must be aligned with sub-micron tolerances to laser diodes and optical waveguides. At present, the state-of-the-art process involves a human operator viewing through microscopes to visually manipulate the waveguides using sub-micron positioning stages; therefore, a large fraction of the cost associated with photonic packaging is due to the time-consuming job of fiber alignment and attachment. 2) After attachment, back reflections from the end of the fiber into the laser diode cavity may disrupt the single-mode operation of the source. The details of the interface geometry can have a profound effect upon the device performance. This paper presents results of single-mode-fiber packaging technology, including automated packaging concepts, back-reflection diagnostics, and modeling.