Vacuum arc deposition using refractory electrodes

Refractory metal plasma generated by a vacuum arc was used to deposit thin films. The deposition rate V
_dep
was measured for different electrode configurations: (1) a planar Zr cathode and a planar W anode-both 60mm diam, (2) 32 mm diam cylindrical W or Mo electrode pairs, and a (3) Nb cylindrical cathode (32 mm diam) closed by a BN plate and a 50 mm diam W shower-head cup anode with either (a) an array of 1 mm diameter exit holes or (b) one 4 mm diam hole Ta cup anode. For Zr films, V
_dep
was 0.8 μm/min at a distance 110 mm from the electrode axis at 90 s after arc ignition. For W films at 60 s after ignition and the planar electrode configuration, V
_dep
was 0.6 μm/min at a distance of 60 mm from the electrode axis. For Nb films deposited with the closed electrode configuration, V
_dep
was 0.3 μm/min at distance 80 mm from the front shower anode surface at 30 s after arc ignition. For cylindrical Mo electrode pair Vdep was about 0.4 μm/min at a distance of 110 mm, 70 s after 200 A arc ignition.