Electromagnetic noise coupling analysis of TSV array by using cylindrical mode expansion method

A semi-analytic approach for the electromagnetic analysis of large numbers of Through silicon vias (TSV) is presented in this paper. The method is based on cylindrical mode expansion method. The scattering and multi reflection effects between the vertical cylindrical vias are considered by expanding the electromagnetic waves surrounding the vias by cylindrical waves. As the method fully captured the physical mechanism of the wave interaction between multiple vias, it can give a high accuracy and fast solution. Based on this method, the effect of the shielding TSVs for the reduction of electromagnetic interference is efficiently analyzed.