Chip cooling with carbon nanotube heat sink

In this paper, lightweight heat sinks based on carbon nanotubes (CNTs) are presented. CNTs were attached on the surface of silicon chips and their heat dissipation performance were monitored. As the morphology of heat sinks is an important factor for the heat dissipation efficiency, two types of CNTs, CNT arrays and sponge CNTs, were used here. Besides, the influence of airflow on the two kinds of CNTs based heat sink was observed by controlling the wind speed. This work gives an excellent reference for a low-cost and high-performance micro-heat sink in the future.