Low-loss silicon interposer for three-dimensional system integration with embedded microfluidic cooling

Novel technology enablers for high-performance three-dimensional (3D) system integration are demonstrated in this paper: (a) A thick silicon interposer with 65 μm diameter and 370 μm tall low-loss polymer-embedded vias on a 150 μm pitch is fabricated and characterized demonstrating a 78% reduction in insertion loss compared to similar-sized conventional TSVs at 50 GHz; (b) Two dice with embedded microfluidic heatsinks and electrical and fluidic microbumps are assembled to an interposer demonstrating lower thermal resistance, chip-to-interposer average electrical microbump resistance of 12.06 mΩ and a robust fluidic microbump interconnection.