Lifetime prediction for stress-induced voiding in nose-shape lines by using a stress-diffusion analytical model

A lifetime prediction model for stress-induced voiding (SIV) in Cu/low-к interconnects has been proposed for nose-shape lines. The stress, baseline, and nose-shape line are related by the Gompertz function. Stress-induced Cu ionic diffusion is described by a differential equation, and the lifetime is a solution of that equation. Finally, the calculated lifetime values are compared to reported values.