3D IC testing using a chip prober and a transparent membrane probe card

We performed pre- and post-bond testing of static random access memory (SRAM)/flash memory chips using a chip prober with a transparent membrane probe card. By deformation of the polyethylene naphthalate film (base material of the probe card) during probing, low-load and damage-less probing was possible, and we successfully conducted pre-bond testing of 30-50-μm-thick SRAM/flash memory chips and post-bond testing of stacked chips.