Fatigue strength of through hole in printed circuit board

Through holes which were for electric signal communication were formed in printed circuit board. The surface of through hole was plated by thin metal and the irregularities were shaped on the free surface or on the interface due to hole-drilling process for making through holes in circuit board. Fracture of through hole was occurred by stress concentration due to its irregularity. In this study, inelastic thermal stress simulation was performed by using a large scale simulator ADVENTURECluster which was based on FEM to discuss fatigue strength around through hole of a printed circuit board.