Novel 3-Dimensional package structure with micro-pins and electronic components

3-Dimensional JISSO technology is important to realize smaller and more advanced electronic device. The conventional POP (Package on Package) is one of the useful technologies for it; however, it has some problems. For example, using TSV (through silicon via) or solder ball makes some limitations to minimize the package size. To solve these problems, we developed new 3-Dimensional package structure using micropin. In our new structure, several micro pins and electronic components are assembled on the large substrate, and molded together with encapsulation resin, and then cut to individual pieces. In this paper, we introduce this newly developed technology.