Compact modeling of STT-MTJ for SPICE simulation

STT-MTJ is a promising device for future high-density and low-power integrated systems. To enable design exploration of STT-MTJ, this paper presents a fully compact model for efficient SPICE simulation. Derived from the fundamental LLG equation, the new model consists of RC elements that are closed-form solutions of device geometry and material properties. They support transient SPICE simulations, providing necessary details beyond the macromodel. The accuracy is validated with numerical results and published data.