Quantitative evaluation of passive-aligned laser diode-to-fiber coupling

Quantitative evaluation of passive-aligned laser diode-to-fiber coupling is presented. From the assembly of 250 transmitter optical subassemblies, flip-chip bonding of laser chips and fiber fixing yields are reported. The coupling characteristics of passive-aligned laser diode modules are evaluated in comparison with the active alignment data and the misalignment tolerances. The assembly and coupling results have showed about 80% overall yield and 1.79 dB/spl plusmn/1.55 dB excess coupling loss, respectively.