Long wavelength transparent epoxy mold optical data link

Optical data links have been spreading widely over various data communication networks. Inexpensive data links are required for further infiltration into communication networks. To meet the market demand, we developed data links with transfer molding technology in 1990 and with flexible printed circuit boards in 1995, respectively. Based on these technologies, transparent epoxy molded optical data links have been developed for further cost reduction. Optical and electrical devices are assembled on a lead frame and molded with transparent epoxy, which works as a package and a lens at the same time. The data link is designed to be used at data rates up to 155.52 Mbps or 200 Mbps.