Dynamically coupled multi-scale plasma/solid modeling tool

Summary form only given. Next-generation plasma-process modeling tools can provide new insight into process dynamics by resolving the diverse length and time scales present in reactor systems. The length scales range from the size of the reactor(/spl sim/10 cm) to surface details (/spl sim/100 nanometers), and time scales from electron sheath-transit times (ns) to total process time (minutes). Other key features include dynamic coupling of the plasma and solid (particles and fields), and the ability to model realistic surface interactions (deposition, etch, sputter, implant, polymerization, etc.). The tool developed here provides all of these features through the coupling of heterogeneous code modules (hybrid plasma, Particle In Cell (PIC) plasma and solid surface/chemistry) and through time-sampling techniques. The hybrid code (particle ions, fluid electrons) provides the basis for modeling the large scale plasma reactor and uses a finite-element mesh to more accurately represent the complex reactor geometries. The PIC code is used in the dynamic sheath boundary region to account for electron movement. The solid surface chemistry code is specially developed to model complex interactions between surface mechanisms, such as the formation of polymer and its possible removal by high energy particles. The solid surface module uses a finite element scheme with adaptive mesh refinement to follow the complex surface evolution. These code modules exchange information on a subRF-period timescale, allowing for direct solid/plasma interactions. The long process times (minutes) are simulated by result-sampling and using the slow evolution of the plasma/solid system. The code also performs surface charge migration, molecular surface dissociation and local gas heating to more completely represent the physical processes occurring in a plasma processing operation.