The use of conduction to cool small form-factor pluggable optical transceivers

Small form-factor pluggable (SFP) optical transceivers present unique thermal challenges. A simple approach was developed that reduced the case temperature of the device by conducting heat through the printed circuit board (PCB) to an underlying heat spreader. This approach does not significantly affect costs and can be applied to a wide range of components and products. © 2007 Alcatel-Lucent.