Experimental and analytical durability assessment of high-temperature, fatigue-resistant solders. I. Constitutive properties

Summary form only given. There is significant need to pursue the development of fatigue-resistant solders for high temperature applications. Use of these solders can result in cost-effective, reliable packaging for extreme environments and/or platforms that do not have expensive active thermal management systems. The durability of high melting-point solders is studied experimentally using a creep-fatigue damage model, i.e., the energy-partitioning model, along with associated creep and plastic constitutive behavior.