DFM of soldering pad of QFP and DIP for wave soldering

Although the surface mount technology has accounted for 90% in the electronic products, the traditional wave soldering technology is still used in the future. This paper mainly discusses the wave soldering technology, focus on the difficult soldering technology of single row of DIP pins with pitch 1.27 mm, and QFP with pitch 0.5 mm. The special soldering pads were designed for the two kinds of components. The normal wave soldering process parameters combining with special coating process were used to solder the experimental board, and the result is what we expected. We get the optimal pad design for QFP with pitch 0.5 mm and the good pad design for single row of DIP pins with pitch 1.27 mm based on the experiment. At the same time, the experimental result shows that the special soldering pad design is needed when QFP and DIP are soldered by wave soldering.