FOUP N2 purge engineering in Fab

Airborne molecular contamination (AMC) becomes more serious in Fab as the device shrinks and wafer size increases, an economic way for preventing these contaminations is to use N
2
purge charging process. The practical FOUP N
2
purge engineering is addressed here, which includes the maintenance and management of FOUPs, N
2
purge charging flow rate, the design of nozzle, selection of nuzzle material, and tool configuration.