Investigation of Quilt Packaging Interchip Interconnect With Solder Paste

We investigate mechanical, thermal, and microwave characteristics of the edge-interconnect scheme called quilt packaging (QP), using a pin transfer method for the application of solder paste. A novel pull test method for QP is introduced, and the pull strength for edge copper nodules is investigated. Thermal shock tests for QP interconnects with solder are performed. Pull strengths for QP interconnects before and after thermal shock are compared and failure mechanisms of QP are investigated. The simulation and experimental results show that QP provides ultrawidebandwidth, and the use of solder paste does not significantly affect the microwave performance of QP.