Temperature Control In Wafer-level Testing Of Large Multi-segment Electromigration Test Structures | IEEE Conference Publication | IEEE Xplore

Temperature Control In Wafer-level Testing Of Large Multi-segment Electromigration Test Structures

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First Page of the Article

Published in: Proceedings of the IEEE International Conference on Microelectronic Test Structures

Date of Conference: 22-23 February 1988

Date Added to IEEE Xplore: 06 August 2002

DOI: 10.1109/ICMTS.1988.672949

Conference Location: Long Beach, CA, USA

First Page of the Article

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